STUDY ON COOLING OF HIGH PERFORMANCE SIC FEATURES

High-performance electronic parts are vital features in almost all modern motorized machines. These silicon components significantly minimised, especially transportation branch. Concentration of performance requires perfect cooling conditions. A fluid flow by an active circuit with heat sinks is a commonly used principle. Sufficient and uniform temperature field on transfer area crucial parameters for the sustainable function Silicon-Carbide components. Producer electric vehicles induces research coolers due to requirements installed SiC features. This study uses advanced CFD methods analyse current state manufactured exchangers provides new approaches optimisation combination 3D printed replacement parts. Approach based print also allows design inspiration natural principles. Biomimetic shows wide range thousands years lasting made nature. Research this can help us evolution enhanced surfaces. Developed were examined techniques. Simulations verified laboratory measurement prototype heatsinks. techniques presented unique sink which was simulated, manufactured, measured. The approaches, describes details measurement, deals negative issues metal print.